Solder Wire, Form Flux-Cored Wire, Material Composition 96.5 Percent Tin, 3 Percent Silver, 0.5 Percent Copper, Wire Diameter 0.8 mm, Weight 500 g, Melting Temperature (Minimum) 422 Degrees F, Melting Temperature (Maximum) 430 Degrees F, Flux Type No-Clean, Flux Classification ROM1, Solder Series SAC M1, For Joining Metal, Application High Soldering Temperature, Container Type Spool
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