S-Parameter Model
SP-78359-001
Material - Plating Mating
Gold
PCB Thickness - Recommended
1.57mm
Material - Metal
Copper Alloy
Voltage - Maximum
30V AC (RMS)/DC
Max. Cycles at Max. Process Temperature
2
Plating min - Mating
0.762µm
Duration at Max. Process Temperature (seconds)
10
Termination Interface: Style
Through Hole
Process Temperature max. C
260
Pitch - Termination Interface
1.00mm
Durability (mating cycles max)
25
Temperature Range - Operating
-55° to +85°C
Material - Resin
High Temperature Thermoplastic
Pitch - Mating Interface
1.00mm
Plating min - Termination
2.540µm
Current - Maximum per Contact
1.0A
Material - Plating Termination
Tin
Country of Origin (subject to change)
Indonesia
